Job Openings (EE senior/principle engineer/Hong Kong/CMOS I (转载)# JobHunting - 待字闺中
H*6
1 楼
最近突然想买面包机 ，恰巧又赶上BF，不晓得有没有好的deal呢？随时准备跳坑中。
m*n
2 楼
【 以下文字转载自 EE 讨论区 】
发信人: macallan (mesh), 信区: EE
标 题: Job Openings (EE senior/principle engineer/Hong Kong/CMOS Image Sensor)
发信站: BBS 未名空间站 (Fri Feb 25 02:08:56 2011, 美东)
Principle Engineer/Senior Engineer
Duties:
• To coordinate IC design and package design teams to implement new
technologies for various CMOS image sensor products;
• To develop and implement new circuits for enhancement of
electrical and optical performance of CMOS image sensor module;
• To work with the process development team to realize the CMOS
image sensor prototypes for various applications;
• To establish the design guidelines for CMOS image sensor chip
packaging, module integration and product development;
• To establish the methodologies for CMOS image sensor module
qualification and performance evaluation.
Requirements:
• Master or above in electrical engineering, materials engineering,
or relevant disciplines;
• 5 years relevant experiences for Master Degree and 2 years
experience for Ph.D.;
• Strong knowledge in CMOS image sensor design and packaging is a
must;
• Good written and communication skills in English and Mandarin;
and
• Strong team spirit.
If interested. PM me. or email your resume to s*****[email protected]
发信人: macallan (mesh), 信区: EE
标 题: Job Openings (EE senior/principle engineer/Hong Kong/CMOS Image Sensor)
发信站: BBS 未名空间站 (Fri Feb 25 02:08:56 2011, 美东)
Principle Engineer/Senior Engineer
Duties:
• To coordinate IC design and package design teams to implement new
technologies for various CMOS image sensor products;
• To develop and implement new circuits for enhancement of
electrical and optical performance of CMOS image sensor module;
• To work with the process development team to realize the CMOS
image sensor prototypes for various applications;
• To establish the design guidelines for CMOS image sensor chip
packaging, module integration and product development;
• To establish the methodologies for CMOS image sensor module
qualification and performance evaluation.
Requirements:
• Master or above in electrical engineering, materials engineering,
or relevant disciplines;
• 5 years relevant experiences for Master Degree and 2 years
experience for Ph.D.;
• Strong knowledge in CMOS image sensor design and packaging is a
must;
• Good written and communication skills in English and Mandarin;
and
• Strong team spirit.
If interested. PM me. or email your resume to s*****[email protected]
l*3
3 楼
我等deal买蒸锅。
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