【 以下文字转载自 EE 讨论区 】 发信人: macallan (mesh), 信区: EE 标 题: Job Openings (EE senior/principle engineer/Hong Kong/CMOS Image Sensor) 发信站: BBS 未名空间站 (Fri Feb 25 02:08:56 2011, 美东) Principle Engineer/Senior Engineer Duties: • To coordinate IC design and package design teams to implement new technologies for various CMOS image sensor products; • To develop and implement new circuits for enhancement of electrical and optical performance of CMOS image sensor module; • To work with the process development team to realize the CMOS image sensor prototypes for various applications; • To establish the design guidelines for CMOS image sensor chip packaging, module integration and product development; • To establish the methodologies for CMOS image sensor module qualification and performance evaluation. Requirements: • Master or above in electrical engineering, materials engineering, or relevant disciplines; • 5 years relevant experiences for Master Degree and 2 years experience for Ph.D.; • Strong knowledge in CMOS image sensor design and packaging is a must; • Good written and communication skills in English and Mandarin; and • Strong team spirit. If interested. PM me. or email your resume to s*****[email protected]