高手帮忙看看这几个NIKON古董头# PhotoGear - 摄影器材
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Component Packaging Engineer
Job Number: 45900366
Job Summary
We are looking for a self-motivated individual who is proficient in FEM
simulation with multi-year hands-on experience of FEM software ASNSY or
ABAQUS. The individual should also be an expert programer of numerical
simulation tools, such as Matlab and Python.
Description
• Numerical modeling of the stress and deformation of component
packages to provide comprehensive understanding of chip-package interaction
and package-board interaction to ensure good device yield and reliability. &
#8226; Programming CAD tools, FEM softwares, and numerical tools to set up
automated model-generation user interfaces and maintain those codes. •
Characterization of component packages under various environmental and
reliability loading conditions, and also key packaging materials. •
Setting up measurement systems (including programming DAQs) for the
characterization of packages of various components.
Education
• PhD degree in Mechanical Engineering, Engineering Mechanics,
Materials Science, Physics or related fields.
IC Packaging Characterization Engineer
Job Number: 47283996
Job Summary
As part of the SEG Packaging team you will focus on developing methodology
of package characterization method, package failure analysis to ensure the
reliability of Apple’s IC packages.
Description
• Characterizing IC packages under various environmental and
reliability testing conditions, such as mechanical loading, thermal and
moisture exposures. • Leading trouble-shooting activities of package
related failures. • Developing material characterization methodologies
, characterizing key packaging materials and supervising material
characterization activities at suppliers.
Education
• M.S. in Materials Science, Chemistry, Metallurgy
Job Number: 45900366
Job Summary
We are looking for a self-motivated individual who is proficient in FEM
simulation with multi-year hands-on experience of FEM software ASNSY or
ABAQUS. The individual should also be an expert programer of numerical
simulation tools, such as Matlab and Python.
Description
• Numerical modeling of the stress and deformation of component
packages to provide comprehensive understanding of chip-package interaction
and package-board interaction to ensure good device yield and reliability. &
#8226; Programming CAD tools, FEM softwares, and numerical tools to set up
automated model-generation user interfaces and maintain those codes. •
Characterization of component packages under various environmental and
reliability loading conditions, and also key packaging materials. •
Setting up measurement systems (including programming DAQs) for the
characterization of packages of various components.
Education
• PhD degree in Mechanical Engineering, Engineering Mechanics,
Materials Science, Physics or related fields.
IC Packaging Characterization Engineer
Job Number: 47283996
Job Summary
As part of the SEG Packaging team you will focus on developing methodology
of package characterization method, package failure analysis to ensure the
reliability of Apple’s IC packages.
Description
• Characterizing IC packages under various environmental and
reliability testing conditions, such as mechanical loading, thermal and
moisture exposures. • Leading trouble-shooting activities of package
related failures. • Developing material characterization methodologies
, characterizing key packaging materials and supervising material
characterization activities at suppliers.
Education
• M.S. in Materials Science, Chemistry, Metallurgy
