d*1
2 楼
Responsibilities:
- signal and power integrity analysis and optimization of passive on-chip,
package, and PCB structures
- interface and work with layout contractors on new high speed flip-chip
package and PCB designs
- characterization of packages and PCBs in the lab
- analyze measurement data and compare with simulation results for
troubleshooting and optimizing package and PCB designs
- model development for high speed I/Os (HSPICE, AMI, etc.)
Requirements:
- MSEE with 3 years of experience o
- signal and power integrity analysis and optimization of passive on-chip,
package, and PCB structures
- interface and work with layout contractors on new high speed flip-chip
package and PCB designs
- characterization of packages and PCBs in the lab
- analyze measurement data and compare with simulation results for
troubleshooting and optimizing package and PCB designs
- model development for high speed I/Os (HSPICE, AMI, etc.)
Requirements:
- MSEE with 3 years of experience o
i*a
3 楼
现在正播着
n*r
5 楼
隔行如隔山啊。不懂
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
g*n
8 楼
公司大小,所在行业,待遇情况。
就算招新毕业生,这些信息还是不能缺。
BTW ,发si-list比发到三藩版强。
就算招新毕业生,这些信息还是不能缺。
BTW ,发si-list比发到三藩版强。
U*G
13 楼
懂点皮毛行不行,很想转硬功
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
k*t
14 楼
能办理身份吗?
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
d*1
15 楼
应该可以吧,我明天去HR问问
c*n
16 楼
楼主给点具体的吧,要是动心了就去写简历,呵呵
公司大小,所在行业,待遇情况。
公司大小,所在行业,待遇情况。
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