8匹马 + 无数奥迪# Joke - 肚皮舞运动
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We currently have openings for background related to photoresist chemistry,
photoresist materials development, at Intel Chandler AZ for microelectronic
packaging materials development.
Please note the position is for recent college graduate only (within 18
month of graduation). If you are interested, please respond via mitbbs site
email ASAP.
thx.
Job Description
Job Description: Microelectronic Packaging Engineers provide project
management, package design/development and sustaining support for integrated
circuit or semiconductor assemblies, various other electronic components
and/or completed units. Defines overall package performance and
specification and realizes technology certification through layout design
and test vehicle design. Conducts tests and research on basic materials and
properties. Establishes material specifications for contract assemblers and
raw material vendors and interfaces with Quality Assurance and Purchasing
regarding material quality and vendor performance. Provides consultation
concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur. Develops
solutions to problems utilizing formal education and judgment.
Qualifications
- Candidate should possess a Ph.D. in Materials Science, Chemistry, Polymer
Science, Chemical Engineering, or any other electronics packaging related
field.
Additional qualifications include:
- Background in photoresist materials development is a must
- Expertise desired includes dry film or liquid resist formulation, resist
development/stripping
- Experience in microfabrication including photolithography, thin film
deposition, and dry/wet etch
- Understanding in polymer materials-structure property relationships and
impact on materials performance is needed.
- Good knowledge on basic Statistical Process Control (SPC) and/or Design of
Experiments (DOE) principles
- Demonstrated technical problem solving skills. Good listening, written and
verbal communication skills.
- Ability to lead and influence both external and internal teams, and work
independently without much supervision.
Business Group
As the world's largest chip manufacturer, Intel strives to make every facet
of semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to final
test and optimization, and lastly packaging. Employees in the Technology and
Manufacturing group are part of a worldwide network of manufacturing and
assembly/test facilities.test facilities.
photoresist materials development, at Intel Chandler AZ for microelectronic
packaging materials development.
Please note the position is for recent college graduate only (within 18
month of graduation). If you are interested, please respond via mitbbs site
email ASAP.
thx.
Job Description
Job Description: Microelectronic Packaging Engineers provide project
management, package design/development and sustaining support for integrated
circuit or semiconductor assemblies, various other electronic components
and/or completed units. Defines overall package performance and
specification and realizes technology certification through layout design
and test vehicle design. Conducts tests and research on basic materials and
properties. Establishes material specifications for contract assemblers and
raw material vendors and interfaces with Quality Assurance and Purchasing
regarding material quality and vendor performance. Provides consultation
concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur. Develops
solutions to problems utilizing formal education and judgment.
Qualifications
- Candidate should possess a Ph.D. in Materials Science, Chemistry, Polymer
Science, Chemical Engineering, or any other electronics packaging related
field.
Additional qualifications include:
- Background in photoresist materials development is a must
- Expertise desired includes dry film or liquid resist formulation, resist
development/stripping
- Experience in microfabrication including photolithography, thin film
deposition, and dry/wet etch
- Understanding in polymer materials-structure property relationships and
impact on materials performance is needed.
- Good knowledge on basic Statistical Process Control (SPC) and/or Design of
Experiments (DOE) principles
- Demonstrated technical problem solving skills. Good listening, written and
verbal communication skills.
- Ability to lead and influence both external and internal teams, and work
independently without much supervision.
Business Group
As the world's largest chip manufacturer, Intel strives to make every facet
of semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to final
test and optimization, and lastly packaging. Employees in the Technology and
Manufacturing group are part of a worldwide network of manufacturing and
assembly/test facilities.test facilities.
