转一篇pro Intel的文章# PDA - 掌中宝
z*n
1 楼
有很多详细的技术数据,很值得一看。
http://seekingalpha.com/article/969951-intel-s-mobile-strategy-
要点
1, 工艺上, 2013年22nm量产,2014年14nm量产;
2, 22nm的haswell已经流片成功,实测8W 情况下性能和17W 的Ivy Bridge(i5)相当.
也就是说明年i5的功耗可以降到8W(!)
3, 现在的Z2760使用的是5年前的atom设计,只是新加了功耗控制,性能超过A9, 但是
不如A15
4, 22nm的silvermont明年年底推出,采用全新体系结构,以后atom产品线要tick-tock
(每年发布)
5, 从长远看,core系列设计和atom系列设计要合并
6, TSM的28nm 工艺和Samsung的32 nm工艺相当。Samsung的双核A15峰值功率>5W, 评论
中有人猜测A15似乎有很大的功耗问题
作者个人感觉:
On the CPU side, I believe that it is fairly incredible that they took the
same, 5 year old core, added a lot of power gating/saving tricks to it (this
is the "heart" of ARM's low power "lead"), and made something very
performance competitive.
The next gen "Silvermont" will be a ground up design that will be targeted
totally for mobile. Remember when "Conroe" hit and took back all the
performance and performance/watt leadership from AMD in one shot? I believe
something will happen with Silvermont.
http://seekingalpha.com/article/969951-intel-s-mobile-strategy-
要点
1, 工艺上, 2013年22nm量产,2014年14nm量产;
2, 22nm的haswell已经流片成功,实测8W 情况下性能和17W 的Ivy Bridge(i5)相当.
也就是说明年i5的功耗可以降到8W(!)
3, 现在的Z2760使用的是5年前的atom设计,只是新加了功耗控制,性能超过A9, 但是
不如A15
4, 22nm的silvermont明年年底推出,采用全新体系结构,以后atom产品线要tick-tock
(每年发布)
5, 从长远看,core系列设计和atom系列设计要合并
6, TSM的28nm 工艺和Samsung的32 nm工艺相当。Samsung的双核A15峰值功率>5W, 评论
中有人猜测A15似乎有很大的功耗问题
作者个人感觉:
On the CPU side, I believe that it is fairly incredible that they took the
same, 5 year old core, added a lot of power gating/saving tricks to it (this
is the "heart" of ARM's low power "lead"), and made something very
performance competitive.
The next gen "Silvermont" will be a ground up design that will be targeted
totally for mobile. Remember when "Conroe" hit and took back all the
performance and performance/watt leadership from AMD in one shot? I believe
something will happen with Silvermont.