Epi / Process/Device/ FA Engineer Openings# EE - 电子工程
b*n
1 楼
我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
或者找一个同行的。谢谢。
或者找一个同行的。谢谢。
f*a
2 楼
开始发点存货……
The Mamas and the Papas的经典。呵呵，希望大家喜欢。
The Mamas and the Papas的经典。呵呵，希望大家喜欢。
a*d
3 楼
今天一回来， 旺才没向平时一样粘过来，躲到一边去了，正奇怪呢，一换拖鞋，就知
道了， 咬个大洞，他还躲在角落里偷偷看我，又好气又好笑，
道了， 咬个大洞，他还躲在角落里偷偷看我，又好气又好笑，
n*d
4 楼
跟老婆一起，一人抬一个。
要交关税吗？很重吗？
是用来孝敬四个老人家的。
要交关税吗？很重吗？
是用来孝敬四个老人家的。
r*z
5 楼
请问，自己报税的话哪种软件比较好？individual,S-corp,C-corp，partnership最好
都有......Lacerte太贵的.
都有......Lacerte太贵的.
l*r
6 楼
WinS (Shenzhen Institute of Wind bandgap Semiconductors深圳第三代半导体研究
院) is seeking the following job candidates. The R&D team consisting of
senior VPs /scientist/engineers/ with 10~20 years experiences in industry
from U.S. Candidates with semiconductor materials/device/process background
and FAB experience are highly recommended. Package is negotiable, benefits
comparable to SUSTech University（南方科技大学）
Candidates with Ph.D from top 150 universities are qualified to get “孔雀计
划A/B/C” with 3.0 to 1.6 million RMB benefits from Shenzhen government, and
will be doubled by Longhua District government. (For example, if you get “
孔雀计划C”, you will get 3.2 million RMB in 5 years, no tax; B for 4.0
million RMB and A for 6 million RMB, respectively).
Please send your C.V. and cover letter to [email protected] if
interested,
thanks.
1. Senior MOCVD Epi Engineer
Responsibility:
• Responsible for the general operation of MOCVD systems and team
management.
• Evaluate epitaxial material using the various characterization
tools.
• Troubleshooting and resolve materials and MOCVD equipment
relatedissues.
• Develop next-generation GaN-based UVA/Blue/Green LED Epi wafers
with shorter process time, high uniformity, high yield, high ESD tolerance,
high LOP and etc.
Qualifications:
• MS/ME or Ph.D. (with 5+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 5 (5+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
2. MOCVD Epi Engineer
Responsibility:
• Responsible for the operation and general maintenance of MOCVD
systems.
• Maintain SPC charts, growth databases, process sheets and
equipment logs.
• Responsible for following safety procedures and protocols in
MOCVD lab.
• Operate epi characterization related tools
• Evaluate epitaxial material using the various characterization
methods.
• Work with epi team to resolve materials and MOCVD equipment
related issues.
Qualifications:
• Ph.D or MS/ME (with 3+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 3 (3+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
3. Process & Device Engineer
Responsibility:
• Responsible for the semiconductor process development of GaN-
based LED devices.
• Maintain SPC charts, process databases, process sheets and
equipment logs.
• Responsible for following safety procedures, general operation
and maintenance protocols in chip FAB.
• Evaluate and analyze LED chip performance using various
characterization methods.
• Work with chip team to troubleshoot and resolve process and
device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with chip fabrication in semiconductor processing,
such as photolithography, clean, etch, thin film deposition, anneal and etc.
• Experience working with III-V Semiconductors (GaN preferred) is
highly desirable. Prior experience in IC industry is a big plus.
• Experience in semiconductor chip processing utilizing design of
experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
4. FA Engineer
Responsibility:
• Responsible for the characterization of LED devices.
• Responsible for following safety procedures and protocols in
characterization FAB.
• Evaluate LED chip performance using the various characterization
methods.
• Works with team to resolve process and device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with characterization of LED devices, such as COT, LOP
, IS, L-I-V, EQE, FIB, SEM and aging test. Understand the semiconductor
optoelectronic device physics.
• Experience in semiconductor backend processing utilizing design
of experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
院) is seeking the following job candidates. The R&D team consisting of
senior VPs /scientist/engineers/ with 10~20 years experiences in industry
from U.S. Candidates with semiconductor materials/device/process background
and FAB experience are highly recommended. Package is negotiable, benefits
comparable to SUSTech University（南方科技大学）
Candidates with Ph.D from top 150 universities are qualified to get “孔雀计
划A/B/C” with 3.0 to 1.6 million RMB benefits from Shenzhen government, and
will be doubled by Longhua District government. (For example, if you get “
孔雀计划C”, you will get 3.2 million RMB in 5 years, no tax; B for 4.0
million RMB and A for 6 million RMB, respectively).
Please send your C.V. and cover letter to [email protected] if
interested,
thanks.
1. Senior MOCVD Epi Engineer
Responsibility:
• Responsible for the general operation of MOCVD systems and team
management.
• Evaluate epitaxial material using the various characterization
tools.
• Troubleshooting and resolve materials and MOCVD equipment
relatedissues.
• Develop next-generation GaN-based UVA/Blue/Green LED Epi wafers
with shorter process time, high uniformity, high yield, high ESD tolerance,
high LOP and etc.
Qualifications:
• MS/ME or Ph.D. (with 5+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 5 (5+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
2. MOCVD Epi Engineer
Responsibility:
• Responsible for the operation and general maintenance of MOCVD
systems.
• Maintain SPC charts, growth databases, process sheets and
equipment logs.
• Responsible for following safety procedures and protocols in
MOCVD lab.
• Operate epi characterization related tools
• Evaluate epitaxial material using the various characterization
methods.
• Work with epi team to resolve materials and MOCVD equipment
related issues.
Qualifications:
• Ph.D or MS/ME (with 3+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 3 (3+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
3. Process & Device Engineer
Responsibility:
• Responsible for the semiconductor process development of GaN-
based LED devices.
• Maintain SPC charts, process databases, process sheets and
equipment logs.
• Responsible for following safety procedures, general operation
and maintenance protocols in chip FAB.
• Evaluate and analyze LED chip performance using various
characterization methods.
• Work with chip team to troubleshoot and resolve process and
device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with chip fabrication in semiconductor processing,
such as photolithography, clean, etch, thin film deposition, anneal and etc.
• Experience working with III-V Semiconductors (GaN preferred) is
highly desirable. Prior experience in IC industry is a big plus.
• Experience in semiconductor chip processing utilizing design of
experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
4. FA Engineer
Responsibility:
• Responsible for the characterization of LED devices.
• Responsible for following safety procedures and protocols in
characterization FAB.
• Evaluate LED chip performance using the various characterization
methods.
• Works with team to resolve process and device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with characterization of LED devices, such as COT, LOP
, IS, L-I-V, EQE, FIB, SEM and aging test. Understand the semiconductor
optoelectronic device physics.
• Experience in semiconductor backend processing utilizing design
of experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
a*e
7 楼
my parents will fly on Dec. 24 from Beijing to SF.
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
x*n
8 楼
唱得蛮有味道
p*e
9 楼
飞上海被查的概率很小,放托运箱里就是
我下周回国要帮人背一个27的回去...
【在 n***d 的大作中提到】
: 跟老婆一起，一人抬一个。
: 要交关税吗？很重吗？
: 是用来孝敬四个老人家的。
我下周回国要帮人背一个27的回去...
【在 n***d 的大作中提到】
: 跟老婆一起，一人抬一个。
: 要交关税吗？很重吗？
: 是用来孝敬四个老人家的。
c*n
10 楼
Proseries
Lacerte 用pay per return 就行了
Lacerte 用pay per return 就行了
l*r
11 楼
GaN HMET/RF/Power Electronics的相关背景也欢迎来洽谈
s*x
12 楼
SFO实在太简单了，又是直飞
http://www.mitbbs.com/article_t/Reunion/31289159.html
好好给你妈妈看了，她就可以帮忙带一下同行的中国人了
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
http://www.mitbbs.com/article_t/Reunion/31289159.html
好好给你妈妈看了，她就可以帮忙带一下同行的中国人了
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
b*e
13 楼
I'm thinking about doing this too.
question:
what kind of hard luggage can accomodate the box of 21.5" iMac?
which can accomodate the 27?!
question:
what kind of hard luggage can accomodate the box of 21.5" iMac?
which can accomodate the 27?!
r*z
14 楼
lacerte还能per return的啊，是online的吗？ ： ）
l*r
15 楼
WinS (Shenzhen Institute of Wind bandgap Semiconductors深圳第三代半导体研究
院) is seeking the following job candidates. The R&D team consisting of
senior VPs /scientist/engineers/ with 10~20 years experiences in industry
from U.S. Candidates with semiconductor materials/device/process background
and FAB experience are highly recommended. Package is negotiable, benefits
comparable to SUSTech University（南方科技大学）
Candidates with Ph.D from top 150 universities are qualified to get “孔雀计
划A/B/C” with 3.0 to 1.6 million RMB benefits from Shenzhen government, and
will be doubled by Longhua District government. (For example, if you get “
孔雀计划C”, you will get 3.2 million RMB in 5 years, no tax; B for 4.0
million RMB and A for 6 million RMB, respectively).
Please send your C.V. and cover letter to [email protected] if
interested,thanks.
1. Senior MOCVD Epi Engineer
Responsibility:
• Responsible for the general operation of MOCVD systems and team
management.
• Evaluate epitaxial material using the various characterization
tools.
• Troubleshooting and resolve materials and MOCVD equipment
relatedissues.
• Develop next-generation GaN-based UVA/Blue/Green LED Epi wafers
with shorter process time, high uniformity, high yield, high ESD tolerance,
high LOP and etc.
Qualifications:
• MS/ME or Ph.D. (with 5+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 5 (5+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
2. MOCVD Epi Engineer
Responsibility:
• Responsible for the operation and general maintenance of MOCVD
systems.
• Maintain SPC charts, growth databases, process sheets and
equipment logs.
• Responsible for following safety procedures and protocols in
MOCVD lab.
• Operate epi characterization related tools
• Evaluate epitaxial material using the various characterization
methods.
• Work with epi team to resolve materials and MOCVD equipment
related issues.
Qualifications:
• Ph.D or MS/ME (with 3+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 3 (3+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
3. Process & Device Engineer
Responsibility:
• Responsible for the semiconductor process development of GaN-
based LED devices.
• Maintain SPC charts, process databases, process sheets and
equipment logs.
• Responsible for following safety procedures, general operation
and maintenance protocols in chip FAB.
• Evaluate and analyze LED chip performance using various
characterization methods.
• Work with chip team to troubleshoot and resolve process and
device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with chip fabrication in semiconductor processing,
such as photolithography, clean, etch, thin film deposition, anneal and etc.
• Experience working with III-V Semiconductors (GaN preferred) is
highly desirable. Prior experience in IC industry is a big plus.
• Experience in semiconductor chip processing utilizing design of
experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
4. FA Engineer
Responsibility:
• Responsible for the characterization of LED devices.
• Responsible for following safety procedures and protocols in
characterization FAB.
• Evaluate LED chip performance using the various characterization
methods.
• Works with team to resolve process and device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with characterization of LED devices, such as COT, LOP
, IS, L-I-V, EQE, FIB, SEM and aging test. Understand the semiconductor
optoelectronic device physics.
• Experience in semiconductor backend processing utilizing design
of experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
院) is seeking the following job candidates. The R&D team consisting of
senior VPs /scientist/engineers/ with 10~20 years experiences in industry
from U.S. Candidates with semiconductor materials/device/process background
and FAB experience are highly recommended. Package is negotiable, benefits
comparable to SUSTech University（南方科技大学）
Candidates with Ph.D from top 150 universities are qualified to get “孔雀计
划A/B/C” with 3.0 to 1.6 million RMB benefits from Shenzhen government, and
will be doubled by Longhua District government. (For example, if you get “
孔雀计划C”, you will get 3.2 million RMB in 5 years, no tax; B for 4.0
million RMB and A for 6 million RMB, respectively).
Please send your C.V. and cover letter to [email protected] if
interested,thanks.
1. Senior MOCVD Epi Engineer
Responsibility:
• Responsible for the general operation of MOCVD systems and team
management.
• Evaluate epitaxial material using the various characterization
tools.
• Troubleshooting and resolve materials and MOCVD equipment
relatedissues.
• Develop next-generation GaN-based UVA/Blue/Green LED Epi wafers
with shorter process time, high uniformity, high yield, high ESD tolerance,
high LOP and etc.
Qualifications:
• MS/ME or Ph.D. (with 5+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 5 (5+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
2. MOCVD Epi Engineer
Responsibility:
• Responsible for the operation and general maintenance of MOCVD
systems.
• Maintain SPC charts, growth databases, process sheets and
equipment logs.
• Responsible for following safety procedures and protocols in
MOCVD lab.
• Operate epi characterization related tools
• Evaluate epitaxial material using the various characterization
methods.
• Work with epi team to resolve materials and MOCVD equipment
related issues.
Qualifications:
• Ph.D or MS/ME (with 3+ years of applicable hands-on experience)
in Physics, Chemical Engineering, Material Science, Electrical Engineering,
or other related discipline(s).
• 3 (3+) years of direct experience with commercial MOCVD process
and equipment technology. Prior track record of GaN epitaxial material
growth is a plus.
• Prior experience in III-V materials characterization techniques
such as: High resolution x-ray diffraction (XRD), Photoluminescence (PL),
Electroluminescence (EL), Atomic force microscopy (AFM), Ellipsometry, SIMS,
and etc. is strongly desired.
• Experience in semiconductor manufacturing epitaxy utilizing
design of experiment (DOE), statistical process control (SPC), and
methodical data analysis for process performance improvement and structured
(root-cause) troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
3. Process & Device Engineer
Responsibility:
• Responsible for the semiconductor process development of GaN-
based LED devices.
• Maintain SPC charts, process databases, process sheets and
equipment logs.
• Responsible for following safety procedures, general operation
and maintenance protocols in chip FAB.
• Evaluate and analyze LED chip performance using various
characterization methods.
• Work with chip team to troubleshoot and resolve process and
device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with chip fabrication in semiconductor processing,
such as photolithography, clean, etch, thin film deposition, anneal and etc.
• Experience working with III-V Semiconductors (GaN preferred) is
highly desirable. Prior experience in IC industry is a big plus.
• Experience in semiconductor chip processing utilizing design of
experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
4. FA Engineer
Responsibility:
• Responsible for the characterization of LED devices.
• Responsible for following safety procedures and protocols in
characterization FAB.
• Evaluate LED chip performance using the various characterization
methods.
• Works with team to resolve process and device related issues.
Qualifications:
• MS/ME (with 3+ years industry experiences), Ph.D (with 1+ year
industry experience) in Physics, Chemical Engineering, Material Science,
Electrical Engineering, or other related discipline(s).
• Experience with characterization of LED devices, such as COT, LOP
, IS, L-I-V, EQE, FIB, SEM and aging test. Understand the semiconductor
optoelectronic device physics.
• Experience in semiconductor backend processing utilizing design
of experiment (DOE), statistical process control (SPC), and methodical data
analysis for process performance improvement and structured (root-cause)
troubleshooting is essential.
• Demonstrated proficiency in the use of statistical analysis
programs for gathering and analyzing process data related to performance
specifications, such as JMP, MiniTab and etc.
• A highly-motivated self-starter with ability to work
independently and a strong team player with good communication skills.
• Ability to adapt to changing priorities, thriving on technical
challenges within and outside of core area of expertise, and to interact
effectively across multi-functional teams.
b*n
16 楼
谢谢大家的回复。刚刚定了26号的机票，直飞。第一次来，不放心。
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
【在 b***n 的大作中提到】
: 我妈刚拿到签证，想在圣诞节或元旦期间来美国，第一次来美国，想找人帮忙带一下，
: 或者找一个同行的。谢谢。
p*e
17 楼
自己用的话别用原装盒了,直接拆开了跟衣服放一起
【在 b****e 的大作中提到】
: I'm thinking about doing this too.
: question:
: what kind of hard luggage can accomodate the box of 21.5" iMac?
: which can accomodate the 27?!
【在 b****e 的大作中提到】
: I'm thinking about doing this too.
: question:
: what kind of hard luggage can accomodate the box of 21.5" iMac?
: which can accomodate the 27?!
l*r
18 楼
GaN HMET/RF/Power Electronics的相关背景也欢迎来洽谈
d*n
19 楼
n*d
20 楼
你说是中国海关查？
托运安全吗？这么贵的东西不自己看着有点担心。我以前来回中美，托运的行李经常被
打开（检查）。
【在 p*********e 的大作中提到】
: 飞上海被查的概率很小,放托运箱里就是
: 我下周回国要帮人背一个27的回去...
托运安全吗？这么贵的东西不自己看着有点担心。我以前来回中美，托运的行李经常被
打开（检查）。
【在 p*********e 的大作中提到】
: 飞上海被查的概率很小,放托运箱里就是
: 我下周回国要帮人背一个27的回去...
s*g
22 楼
这玩意偷起来有难度吧，死沉死沉，话说俺也要抗一个回去了，塞衣服堆里是个好办法。
【在 n***d 的大作中提到】
: 你说是中国海关查？
: 托运安全吗？这么贵的东西不自己看着有点担心。我以前来回中美，托运的行李经常被
: 打开（检查）。
【在 n***d 的大作中提到】
: 你说是中国海关查？
: 托运安全吗？这么贵的东西不自己看着有点担心。我以前来回中美，托运的行李经常被
: 打开（检查）。
b*e
23 楼
what?!
without shipping box...dame risky...
without shipping box...dame risky...
c*k
24 楼
有偷托运行李里面的相机、摄像机的，你们还是小心点。
n*d
25 楼
就是担心这个。而且怕屏幕给摔坏了。
【在 c*******k 的大作中提到】
: 有偷托运行李里面的相机、摄像机的，你们还是小心点。
【在 c*******k 的大作中提到】
: 有偷托运行李里面的相机、摄像机的，你们还是小心点。
y*r
26 楼
我上个月弄回去一台。原装纸箱外加amazon寄过来时候外套的纸箱，然后自己垫了N多
东西，最外面在机场又打了一道。
不如在国内买得了，省事得多。那东西是不可能让你提在手里拿上飞机的，只能托运。
【在 n***d 的大作中提到】
: 就是担心这个。而且怕屏幕给摔坏了。
东西，最外面在机场又打了一道。
不如在国内买得了，省事得多。那东西是不可能让你提在手里拿上飞机的，只能托运。
【在 n***d 的大作中提到】
: 就是担心这个。而且怕屏幕给摔坏了。
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