求review机会，固体力学# Immigration - 落地生根
m*i
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constitutive modeling: creep, viscoelasticity, plasticity
failure and analysis in composite materials
impact dynamics, buckling, shock, and vibration isolation
finite element modeling in semi-conductor packaging (solder, PCB, silicon
chips and coatings), pipelines,drilling tools etc.
failure and analysis in composite materials
impact dynamics, buckling, shock, and vibration isolation
finite element modeling in semi-conductor packaging (solder, PCB, silicon
chips and coatings), pipelines,drilling tools etc.