avatar
d*a
1
Please reply to mailbox for further inquiry/Referral.
Please Note job opening is for PHD RCG (18 month prior or post graduation
date) only. Candidates with chem, polymer, materials science background are
encouraged
to apply.
Description
Job Description: Packaging Engineers provide package development and
sustaining support for integrated circuit or semiconductor assemblies,
various other electronic components and/or completed units. Conducts tests
and research on basic materials and properties. Establishes material
specifications for contract assemblers and raw material vendors and
interfaces with Quality Assurance and Purchasing regarding material quality
and vendor performance. Provides consultation concerning packaging problems
and improvements in the packaging process. Responds to customer/client
requests or events as they occur. Develops solutions to problems utilizing
formal education and judgement.
Qualifications
You must possess a Ph. D. in Material Science or a Master of Science degree
in Material Science with more than two years of relevant working experience
. Additional qualifications include:
- Excellent working experience in handling analytical tools
- Working experience in relationship between processing vs. microstructure
vs. mechanical and physical properties of materials (polymers, composites,
metals and ceramics)
- Working knowledge in fracture and adhesion mechanisms of materials and
material interfaces
- Working knowledge in fundamentals of materials science and engineering
- Excellent knowledge in metal solidification process/phase diagrams,
polymerization, deformation of materials, and material development
- Good problem-solving, data analysis, statistical design, and analysis
skills
- Good communication skills
- Ability to work in a team environment across multi-geographies
- Ability to travel overseas extensively
Job Category
Primary Location
Organization
Full/Part Time
avatar
r*o
2
chase freedom
avatar
G*D
3
刚买的laptop的处理器是Intel 2020M,这颗应该是低阶处理器,但转CAD的速度却比我
另一台用i5-520M的还快,不只如此,连打脸书的小游戏也比较不顿,现在低阶处理器
的效能已经有第一代i5的水平了吗?
avatar
l*x
5
"Ability to travel overseas extensively" means at least GC?

are

【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material

avatar
s*c
6
We wish
avatar
a*z
7
敢问是哪款笔记本?

刚买的laptop的处理器是Intel 2020M,这颗应该是低阶处理器,但转CAD的速度却比我
另一台用i5-520M的还快,不只如此,连打脸书的小游戏也比较不顿,现在低阶处理...
.....

【在 G*D 的大作中提到】
: 刚买的laptop的处理器是Intel 2020M,这颗应该是低阶处理器,但转CAD的速度却比我
: 另一台用i5-520M的还快,不只如此,连打脸书的小游戏也比较不顿,现在低阶处理器
: 的效能已经有第一代i5的水平了吗?

avatar
l*s
9
why PHD? is this Intel Labs?

graduation
are
tests

【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material

avatar
z*5
10
no
avatar
G*D
11
刚买的是ASUS X55A,旧机是Lenovo T410
两台都是4GB
avatar
s*u
12
Thanks!
avatar
B*R
13
sent into your inbox just now
avatar
d*o
14
no
avatar
j*f
15
很正常
avatar
P*e
16
should work with Shanghai Backend Fabs.
Like Amkor or Statschippac

why PHD? is this Intel Labs?
graduation
are
tests

【在 l******s 的大作中提到】
: why PHD? is this Intel Labs?
:
: graduation
: are
: tests

avatar
s*g
17
typically no
avatar
t*t
18
频率一样,二代比一代强也不奇怪。

【在 G*D 的大作中提到】
: 刚买的laptop的处理器是Intel 2020M,这颗应该是低阶处理器,但转CAD的速度却比我
: 另一台用i5-520M的还快,不只如此,连打脸书的小游戏也比较不顿,现在低阶处理器
: 的效能已经有第一代i5的水平了吗?

avatar
g*u
19
Does Intel have labs in CA or NC?

are

【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material

avatar
s*g
20
typically no
avatar
G*D
21

那差不多是时候让T410退休了

【在 j***f 的大作中提到】
: 很正常
avatar
d*g
22
no
avatar
g*t
23
新cpu都快,
avatar
l*h
24
试过,statement已出,无

【在 r****o 的大作中提到】
: chase freedom
avatar
i*h
25
2020M就是cache少点,没有HT,关掉了一些虚拟机之类的高级功能。主频、设计、工艺
和同一代的i3i5差不多。还有就是GPU差点。
相同主频的话单任务+1~2线程和i3i5没什么区别。HT效率要看具体应用,有的时候开还
不如不开。
avatar
P*L
26
1% 该有吧?

【在 l***h 的大作中提到】
: 试过,statement已出,无
avatar
l*h
27
有,犯不上,有2%的不用?

【在 P*******L 的大作中提到】
: 1% 该有吧?
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