求文献，包子感谢！# Biology - 生物学
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【 以下文字转载自 EE 讨论区 】
发信人: windowsxp (windowsxp), 信区: EE
标 题: [Job Opening] RF Product Layout Engineer: MMIC, Module, PCB
发信站: BBS 未名空间站 (Thu Jan 5 18:18:42 2012, 美东)
Please send your resume to HR directly. Thanks.
1. RF Product Layout Engineer: MMIC, Module, PCB
(1) RF Front End MMIC layout experience: Handset GSM/EDGE & WCDMA/LTE Power
Amplifier and Front-End Module, WiFi/WiMax Power Amplifier and Front-End
Module, Low Noise Amplifier, SPXT Switches, filter & duplexer & diplexer
designs, Frequency ~ 1GHz-10GHz.
(2) Familiar with MMIC layout for both Wire Bond and Flip Chip RF Front-End
products, such as Power Amplifier Module or RF Front-End Module.
(3) Familiar with MMIC design and layout tools, such as Agilent ADS, AWR MWO
& AutoCad, Cadence, etc.
(4) Familiar with MMIC Foundry Design Rule, such as WIN (GaAs MMIC), UMC,
TSMC (CMOS Control Circuit) Design Rule.
(5) PCB design and layout experience: Design PCB to evaluate PA, LNA, Switch
, filter, Front-End Modules, etc. products.
(6) Laminate module design and layout experience: Develop PA module and RF
Front-End module in Compact Size, Low Cost, Laminate module.
(7) Familiar with Laminate module House Design Rule, such as Kinsus, etc.
(8) Familiar with Module Product Auto Assembly House Capability to layout
module with High Yield.
(9) Prepare Module Product BOM list along with Module Drawing for Product
Auto Assembly.
(10) Order parts on BOM list for Engineer Product Development.
(11) Good Computer Skill.
Epicom Website & US Office Address:
Website: http://www.epic.com.tw
US Office Address: 1231 Bordeaux Drive, Sunnyvale, CA 94089
Epicom Human Resource Contacts:
Minh-Tam Nguyen: (408) 752-9186, Email: m*****[email protected]
发信人: windowsxp (windowsxp), 信区: EE
标 题: [Job Opening] RF Product Layout Engineer: MMIC, Module, PCB
发信站: BBS 未名空间站 (Thu Jan 5 18:18:42 2012, 美东)
Please send your resume to HR directly. Thanks.
1. RF Product Layout Engineer: MMIC, Module, PCB
(1) RF Front End MMIC layout experience: Handset GSM/EDGE & WCDMA/LTE Power
Amplifier and Front-End Module, WiFi/WiMax Power Amplifier and Front-End
Module, Low Noise Amplifier, SPXT Switches, filter & duplexer & diplexer
designs, Frequency ~ 1GHz-10GHz.
(2) Familiar with MMIC layout for both Wire Bond and Flip Chip RF Front-End
products, such as Power Amplifier Module or RF Front-End Module.
(3) Familiar with MMIC design and layout tools, such as Agilent ADS, AWR MWO
& AutoCad, Cadence, etc.
(4) Familiar with MMIC Foundry Design Rule, such as WIN (GaAs MMIC), UMC,
TSMC (CMOS Control Circuit) Design Rule.
(5) PCB design and layout experience: Design PCB to evaluate PA, LNA, Switch
, filter, Front-End Modules, etc. products.
(6) Laminate module design and layout experience: Develop PA module and RF
Front-End module in Compact Size, Low Cost, Laminate module.
(7) Familiar with Laminate module House Design Rule, such as Kinsus, etc.
(8) Familiar with Module Product Auto Assembly House Capability to layout
module with High Yield.
(9) Prepare Module Product BOM list along with Module Drawing for Product
Auto Assembly.
(10) Order parts on BOM list for Engineer Product Development.
(11) Good Computer Skill.
Epicom Website & US Office Address:
Website: http://www.epic.com.tw
US Office Address: 1231 Bordeaux Drive, Sunnyvale, CA 94089
Epicom Human Resource Contacts:
Minh-Tam Nguyen: (408) 752-9186, Email: m*****[email protected]
