Cadence和Rambus达成收购协议,涉及Phy IP
来源:内容来自半导体行业观察(ID:icbank)综合,谢谢。
Cadence Design Systems, Inc.和Rambus Inc今天宣布,双方已就Cadence收购Rambus SerDes和内存接口PHY IP业务达成最终协议。收购完成后,Rambus 将保留其数字 IP 业务,包括内存和接口控制器以及安全 IP。据报道,预期的技术资产购买还将在美国、印度和加拿大给Cadence带来经过验证且经验丰富的 PHY 工程团队,进一步扩大 Cadence 领域丰富的人才基础。
Cadence 高级副总裁兼 IP 部门总经理 Boyd Phelps 表示:“内存和 SerDes IP 设计和集成仍然是人工智能、数据中心和超大规模应用、CPU 架构和网络设备设计中不可或缺的一部分,Rambus IP 和经验丰富的团队的加入进一步加速了 Cadence 的智能系统设计战略,从而推动卓越设计。” “收购 Rambus PHY IP 拓宽了 Cadence 完善的企业 IP 产品组合,并扩大了其跨地域和垂直市场的影响力,例如航空航天和国防市场,提供完整的子系统解决方案,满足我们全球客户的需求。”
Rambus 高级副总裁兼首席运营官 Sean Fan 表示:“人工智能的加速发展和数据中心的持续增长正在推动对内存和安全性的需求不断增长。” “通过此次交易,我们将更加关注市场领先的数字IP和芯片,并扩展我们新型内存解决方案的路线图,以支持数据中心和人工智能的持续发展。”
预计此次交易对每家公司今年的收入和盈利影响不大。预计将于 2023 年第三季度完成,但须满足某些成交条件。
Cadence to Acquire Rambus PHY IP Assets
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. The expected technology asset purchase also brings Cadence proven and experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence’s domain-rich talent base.
“Memory and SerDes IP design and integration continues to be integral to the design of AI, data center and hyperscale applications, CPU architectures and networking devices, and the addition of the Rambus IP and seasoned team further accelerates Cadence’s Intelligent System Design strategy, which drives design excellence,” said Boyd Phelps, senior vice president and general manager of the IP Group at Cadence. “The acquisition of the Rambus PHY IP broadens Cadence’s well-established enterprise IP portfolio and expands its reach across geographies and vertical markets, such as the aerospace and defense market, providing complete subsystem solutions that meet the demands of our worldwide customers.”
“The accelerating momentum of AI and continued growth in the data center is driving ever-increasing demand for memory and security,” said Sean Fan, senior vice president and chief operating officer at Rambus. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI.”
The transaction is expected to be immaterial to revenue and earnings this year for each company. It is expected to close in the third calendar quarter of 2023, subject to certain closing conditions.
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